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Thin Film Circuit Board - List of Manufacturers, Suppliers, Companies and Products

Thin Film Circuit Board Product List

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[Circuit Board Manufacturing Example] Thin Film Circuit Board

We can accommodate a wide range of processing variations! We can also handle processing on supplied materials or only specific processes.

This is a manufacturing example of thin film circuit substrates that combines vacuum film formation through sputtering and deposition with photolithography. We can accommodate a wide range of processing variations, including hole drilling and contour cutting using lasers and dicing, as well as thin film resistor formation, providing high-quality thin film circuit substrates with a high degree of design flexibility. We can also process supplied materials or handle only specific processes. 【Case Overview】 ■Materials: Alumina, Aluminum Nitride, Quartz Glass, etc. ■Thickness: 0.1 to 1.0 mm ■Conductor Films: Ti/Pd/Au, Ti/Pd/Cu/Ni/Au, Ti/Pt/Au, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • Circuit board design and manufacturing

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Thin film circuit board, thin film metallization.

MARUWA's thin film circuit boards are substrate materials created as a result of the fusion of various proven ceramic materials and the thin film metallization technology developed over many years.

Thin film circuit substrates are materials created from the fusion of various proven ceramic materials and the thin film metallization technology developed over many years. Customization is possible through diverse pattern formation techniques, such as side metallization. They are used in circuit substrates for optical storage, optical communication, and RF applications. Through the integration of the thin film metallization technology that MARUWA has cultivated over many years and the underlying ceramic material technology, a consistent production process from material to thin film formation has been achieved. By using substrates with excellent heat dissipation properties, such as alumina substrates, aluminum nitride substrates, multilayer substrates, and dielectric ceramics, it is possible to form advanced circuit patterns that meet high integration and electrical characteristics.

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Thin film circuit substrate (submount/carrier) *Technical materials available for free!

Application of film formation technology and thin film processing technology to submounts with increasing demand!

Our company applies and develops the film formation and thin film processing technologies cultivated in the manufacturing of thin film magnetic heads (HDD, FDD) and optical prism components to create thin film electrodes, resistive films, and solder films tailored to substrates such as ceramic substrates, forming them into high-precision fine circuit patterns. We are also capable of patterning on three-dimensional surfaces and thick film Cu plating. Our customers use our products not only in Japan but also in various countries around the world, including Asia and Europe and the Americas. We will continue to develop new technologies in the future. ■ Standard substrate materials (thermal conductivity W/m·K) AlN (170~230) AlN/Cu (~270) SiC (~370) ■ Applications Laser diode (LD) mounting substrates Light-emitting diode (LED) mounting substrates Photodiode (PD) mounting substrates ■ Laser market applications Visible light semiconductor lasers Optical communication (FTTx, data centers, mobile base stations) Consumer industrial applications (sensors, LiDAR, laser processing, medical) Lighting (projectors, automotive headlights), etc.

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  • Circuit board design and manufacturing

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Thin film circuit substrate for semiconductors (submount/carrier)

Free distribution of technical materials on thin film circuit board technology that supports high performance!

In the semiconductor industry, with the advancement of device performance, there is a demand for miniaturization, high density, and high thermal conductivity of substrates. In particular, high-frequency characteristics and thermal management are crucial factors that influence device performance. Inadequate substrates can lead to signal degradation and failures due to overheating. Our thin-film circuit substrates utilize film deposition technology and thin-film processing technology to address these challenges. 【Application Scenarios】 - Laser Diode (LD) mounting substrates - Light Emitting Diode (LED) mounting substrates - Photodiode (PD) mounting substrates 【Benefits of Implementation】 - High-density mounting through the formation of high-precision fine circuit patterns - Extended device lifespan due to excellent thermal conductivity - Improved design flexibility through patterning on three-dimensional surfaces and thick-film copper plating support

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  • Circuit board design and manufacturing

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Thin Film Circuit Board for High-Speed Transmission

High-precision thin-film circuit boards that support high-speed data communication.

In the telecommunications industry, especially in fields where high-speed data transmission is required, the transmission speed and reliability of signals are crucial. Thin-film circuit boards are essential to meet these demands, utilizing materials with excellent high-frequency characteristics and microfabrication technology. Our thin-film circuit boards enhance signal integrity in high-speed data transmission, enabling stable communication. 【Application Scenarios】 - Optical communication (FTTx, data centers, mobile base stations) 【Benefits of Implementation】 - Stabilization of high-speed data transmission - Improvement of signal quality - Increase in communication speed

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  • Circuit board design and manufacturing

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Thin film circuit board for medical devices

Thin film circuit boards that contribute to the miniaturization of medical devices.

In the medical device industry, there is a demand for miniaturization and high-precision components. In particular, miniaturizing parts is a critical challenge to pack many functions into limited space. Our thin-film circuit boards contribute to solving this challenge in the design of medical devices that require small, precise, and high-accuracy components. 【Application Scenarios】 - Endoscopes - Portable diagnostic devices - Biosensors 【Benefits of Implementation】 - Miniaturization of devices - Improved functionality through high-density mounting - Enhanced reliability

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  • Circuit board design and manufacturing

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Thin film circuit board for automobiles (submount carrier)

Achieve high reliability with thin-film circuit boards. Free technical materials available!

In the automotive industry, the reliability of electronic components is extremely important. In particular, vehicle-mounted electronic devices used in harsh environments require high durability to withstand temperature changes, vibrations, and shocks. Thin film circuit boards provide high-precision fine circuit patterns and excellent thermal conductivity to meet these demands. Our thin film circuit boards contribute to various automotive applications, such as laser diode (LD) mounting boards. 【Usage Scenarios】 - Vehicle radar - Headlights - Vehicle sensors 【Benefits of Implementation】 - Achieving high reliability - Extending product lifespan - Performance improvement

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  • Circuit board design and manufacturing

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Thin Film Circuit Board for IoT (Submount Carrier)

Thin film circuit boards that contribute to the performance improvement of energy-saving IoT devices.

In the IoT industry, there is a demand for extended battery life and miniaturization of devices. Particularly for devices that operate on limited power, such as sensors and wearable devices, reducing power consumption is crucial. Thin-film circuit boards enable high-density integration and low power consumption, contributing to the energy efficiency of IoT devices. 【Use Cases】 - Wearable devices - Various sensors - IoT gateways 【Benefits of Implementation】 - Extended battery life - Miniaturization of devices - High reliability

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  • Circuit board design and manufacturing

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Thin-film circuit board for wearables

Thin film circuit boards that achieve high-density implementation. Contributing to miniaturization and high performance.

In the wearable device industry, there is a simultaneous demand for miniaturization and high functionality. As devices become smaller, high-density mounting becomes essential, and the performance of the substrate influences the overall performance of the product. Our thin-film circuit substrates enable high-density mounting through high-precision fine circuit pattern formation technology. This contributes to the miniaturization and high performance of wearable devices. 【Usage Scenarios】 - Wearable devices requiring high-density mounting - Devices that need to be compact and lightweight - Devices aiming for high performance 【Benefits of Implementation】 - Miniaturization of devices - Performance improvement - Increased reliability

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  • 0930_022s.jpg
  • Circuit board design and manufacturing

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Thin film circuit board for robotics

High-precision thin-film circuit boards that support precision control.

In the field of robotics, precise control requires miniaturization and high accuracy. Particularly in areas that control complex movements, such as robotic arms and sensors, the performance of circuit boards is crucial. Thin-film circuit boards have been developed to meet these demands. 【Application Scenarios】 - Precise control of robotic arms - High performance of various sensors - Robots requiring miniaturization and lightweight design 【Effects of Implementation】 - Achieving high-precision control - Expanding the range of motion through miniaturization - Increased longevity due to high reliability

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  • Circuit board design and manufacturing

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Thin Film Circuit Board for VR/AR

Thin-film circuit boards optimal for high-resolution VR/AR devices.

In the VR/AR industry, high-resolution displays are required to enhance immersion. In particular, substrates that enable miniaturization and high-density implementation are important. Thin-film circuit boards have been developed to meet these needs. 【Use Cases】 - High-resolution VR/AR headsets - AR glasses - Compact displays 【Benefits of Implementation】 - High-definition image display - Miniaturization of devices - Improved reliability

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  • Circuit board design and manufacturing

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Thin film circuit board for measuring instruments

Thin film circuit boards contributing to high-precision measurement.

In the measurement instrument industry, high-precision measurement results require advanced substrate microfabrication technology and high thermal conductivity. This is particularly important for instruments that are susceptible to temperature changes and electrical noise, where maintaining stable performance is crucial. Inappropriate substrates can lead to measurement errors and failures. Our thin-film circuit substrates utilize high-precision micro-circuit pattern formation technology and materials with excellent thermal conductivity, enabling high-precision measurements. 【Application Scenarios】 - High-precision measuring instruments - Laser diode mounting substrates - Light-emitting diode (LED) mounting substrates - Photodiode (PD) mounting substrates 【Benefits of Implementation】 - Achievement of high-precision measurement results - Improved product reliability - Assurance of long-term stability

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  • Circuit board design and manufacturing

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Frequently Asked Questions about Thin Film Circuit Boards (Carrier and Submount)

We introduce frequently asked questions about thin film circuit substrates (carrier and submount)!

Here are some frequently asked questions about the "thin film circuit boards (carrier/submount)" that we handle. Starting with "What kind of metal is the metal thin film?" and including questions like "What is the composition of the solder? (types)" and "What kinds of films can be made with metals?" we provide answers to many inquiries. Feel free to use this information for product selection, and don't hesitate to contact us for more details. 【Excerpt of Questions】 ■ What kind of metal is the metal thin film? ■ What is the composition of the solder? (types) ■ What methods can be used for patterns? ■ What types of substrates can be prepared? ■ What kinds of equipment are available? *For more details, please refer to the related links or feel free to contact us.

  • Other metal materials

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Thin Film Circuit Board for Aerospace Applications

A thin film circuit board that achieves weight reduction. High-precision fine circuit pattern formation.

In the aerospace industry, reducing the weight of aircraft is a crucial challenge for improving fuel efficiency and flight performance. Thin-film circuit boards contribute to weight reduction compared to conventional boards, enhancing the performance of aircraft. Our thin-film circuit boards meet the lightweight needs in the aerospace field through high-precision fine circuit pattern formation technology for thin-film electrodes, resistive films, and solder films on ceramic substrates and others. 【Application Scenarios】 - Aircraft, artificial satellites, space exploration vehicles - Radar systems, communication systems - Various sensors 【Benefits of Implementation】 - Improved fuel efficiency due to weight reduction - Enhanced aircraft performance - Reliable circuit design

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  • Circuit board design and manufacturing

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Thin film circuit board for energy efficiency.

Contributing to energy efficiency with film formation technology and thin film processing technology!

The energy industry is demanding energy conservation and efficient power supply. In particular, high-performance electronic components are essential in solar power generation and next-generation energy systems. Thin-film circuit boards contribute to the miniaturization and high performance of devices in these systems. Our thin-film circuit boards utilize film formation and thin-film processing technologies to create highly precise fine circuit patterns. 【Application Scenes】 - Solar power generation systems - LED lighting - Laser application devices 【Benefits of Implementation】 - Miniaturization and high performance of devices - Improved heat dissipation due to high thermal conductivity - Provision of highly reliable products

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  • Circuit board design and manufacturing

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