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Thin Film Circuit Board - List of Manufacturers, Suppliers, Companies and Products

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[Circuit Board Manufacturing Example] Thin Film Circuit Board

[Circuit Board Manufacturing Example] Thin Film Circuit Board

We can accommodate a wide range of processing variations! We can also handle processing on supplied materials or only specific processes.

This is a manufacturing example of thin film circuit substrates that combines vacuum film formation through sputtering and deposition with photolithography. We can accommodate a wide range of processing variations, including hole drilling and contour cutting using lasers and dicing, as well as thin film resistor formation, providing high-quality thin film circuit substrates with a high degree of design flexibility. We can also process supplied materials or handle only specific processes. 【Case Overview】 ■Materials: Alumina, Aluminum Nitride, Quartz Glass, etc. ■Thickness: 0.1 to 1.0 mm ■Conductor Films: Ti/Pd/Au, Ti/Pd/Cu/Ni/Au, Ti/Pt/Au, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • Circuit board design and manufacturing

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Thin film circuit board, thin film metallization.

Thin film circuit board, thin film metallization.

MARUWA's thin film circuit boards are substrate materials created as a result of the fusion of various proven ceramic materials and the thin film metallization technology developed over many years.

Thin film circuit substrates are materials created from the fusion of various proven ceramic materials and the thin film metallization technology developed over many years. Customization is possible through diverse pattern formation techniques, such as side metallization. They are used in circuit substrates for optical storage, optical communication, and RF applications. Through the integration of the thin film metallization technology that MARUWA has cultivated over many years and the underlying ceramic material technology, a consistent production process from material to thin film formation has been achieved. By using substrates with excellent heat dissipation properties, such as alumina substrates, aluminum nitride substrates, multilayer substrates, and dielectric ceramics, it is possible to form advanced circuit patterns that meet high integration and electrical characteristics.

  • Printed Circuit Board

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Thin film circuit substrate (submount/carrier) *Technical materials available for free!

Thin film circuit substrate (submount/carrier) *Technical materials available for free!

Application of film formation technology and thin film processing technology to submounts with increasing demand!

Our company applies and develops the film formation and thin film processing technologies cultivated in the manufacturing of thin film magnetic heads (HDD, FDD) and optical prism components to create thin film electrodes, resistive films, and solder films tailored to substrates such as ceramic substrates, forming them into high-precision fine circuit patterns. We are also capable of patterning on three-dimensional surfaces and thick film Cu plating. Our customers use our products not only in Japan but also in various countries around the world, including Asia and Europe and the Americas. We will continue to develop new technologies in the future. ■ Standard substrate materials (thermal conductivity W/m·K) AlN (170~230) AlN/Cu (~270) SiC (~370) ■ Applications Laser diode (LD) mounting substrates Light-emitting diode (LED) mounting substrates Photodiode (PD) mounting substrates ■ Laser market applications Visible light semiconductor lasers Optical communication (FTTx, data centers, mobile base stations) Consumer industrial applications (sensors, LiDAR, laser processing, medical) Lighting (projectors, automotive headlights), etc.

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  • Circuit board design and manufacturing

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Frequently Asked Questions about Thin Film Circuit Boards (Carrier and Submount)

Frequently Asked Questions about Thin Film Circuit Boards (Carrier and Submount)

We introduce frequently asked questions about thin film circuit substrates (carrier and submount)!

Here are some frequently asked questions about the "thin film circuit boards (carrier/submount)" that we handle. Starting with "What kind of metal is the metal thin film?" and including questions like "What is the composition of the solder? (types)" and "What kinds of films can be made with metals?" we provide answers to many inquiries. Feel free to use this information for product selection, and don't hesitate to contact us for more details. 【Excerpt of Questions】 ■ What kind of metal is the metal thin film? ■ What is the composition of the solder? (types) ■ What methods can be used for patterns? ■ What types of substrates can be prepared? ■ What kinds of equipment are available? *For more details, please refer to the related links or feel free to contact us.

  • Other metal materials

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