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Thin Film Circuit Board Product List

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[Circuit Board Manufacturing Example] Thin Film Circuit Board

We can accommodate a wide range of processing variations! We can also handle processing on supplied materials or only specific processes.

This is a manufacturing example of thin film circuit substrates that combines vacuum film formation through sputtering and deposition with photolithography. We can accommodate a wide range of processing variations, including hole drilling and contour cutting using lasers and dicing, as well as thin film resistor formation, providing high-quality thin film circuit substrates with a high degree of design flexibility. We can also process supplied materials or handle only specific processes. 【Case Overview】 ■Materials: Alumina, Aluminum Nitride, Quartz Glass, etc. ■Thickness: 0.1 to 1.0 mm ■Conductor Films: Ti/Pd/Au, Ti/Pd/Cu/Ni/Au, Ti/Pt/Au, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • Circuit board design and manufacturing
  • Thin Film Circuit Board

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Thin film circuit board, thin film metallization.

MARUWA's thin film circuit boards are substrate materials created as a result of the fusion of various proven ceramic materials and the thin film metallization technology developed over many years.

Thin film circuit substrates are materials created from the fusion of various proven ceramic materials and the thin film metallization technology developed over many years. Customization is possible through diverse pattern formation techniques, such as side metallization. They are used in circuit substrates for optical storage, optical communication, and RF applications. Through the integration of the thin film metallization technology that MARUWA has cultivated over many years and the underlying ceramic material technology, a consistent production process from material to thin film formation has been achieved. By using substrates with excellent heat dissipation properties, such as alumina substrates, aluminum nitride substrates, multilayer substrates, and dielectric ceramics, it is possible to form advanced circuit patterns that meet high integration and electrical characteristics.

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Thin film circuit substrate (submount/carrier) *Technical materials available for free!

Application of film formation technology and thin film processing technology to submounts with increasing demand!

Our company applies and develops the film formation and thin film processing technologies cultivated in the manufacturing of thin film magnetic heads (HDD, FDD) and optical prism components to create thin film electrodes, resistive films, and solder films tailored to substrates such as ceramic substrates, forming them into high-precision fine circuit patterns. We are also capable of patterning on three-dimensional surfaces and thick film Cu plating. Our customers use our products not only in Japan but also in various countries around the world, including Asia and Europe and the Americas. We will continue to develop new technologies in the future. ■ Standard substrate materials (thermal conductivity W/m·K) AlN (170~230) AlN/Cu (~270) SiC (~370) ■ Applications Laser diode (LD) mounting substrates Light-emitting diode (LED) mounting substrates Photodiode (PD) mounting substrates ■ Laser market applications Visible light semiconductor lasers Optical communication (FTTx, data centers, mobile base stations) Consumer industrial applications (sensors, LiDAR, laser processing, medical) Lighting (projectors, automotive headlights), etc.

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  • Circuit board design and manufacturing
  • Thin Film Circuit Board

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High performance enhancement of thin film circuit boards for semiconductors.

Thin film circuit boards support the high performance of semiconductors.

In the semiconductor industry, as devices become more high-performance, substrates that allow for heat dissipation and high-density mounting are in demand. Particularly in the mounting of laser diodes and LEDs, fine circuit patterns and high thermal conductivity are crucial. Inappropriate substrates can lead to decreased device performance and shortened lifespan. Our thin-film circuit substrates apply film formation and thin-film processing technologies to achieve highly precise fine circuit patterns and excellent thermal conductivity. 【Application Scenes】 Laser Diode (LD) mounting substrates Light Emitting Diode (LED) mounting substrates Photodiode (PD) mounting substrates Optical communication (FTTx, data centers, mobile base stations) 【Benefits of Introduction】 Contributes to high performance of devices Achieves high reliability Contributes to miniaturization and high-density mounting of products

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  • Circuit board design and manufacturing
  • Thin Film Circuit Board

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Thin film circuit board for medical devices

Thin film circuit boards that contribute to the miniaturization of medical devices.

In the medical device industry, there is a demand for miniaturization and high-precision components. In particular, miniaturizing parts is a crucial challenge in order to pack many functions into limited space. Our thin-film circuit boards contribute to solving this challenge in the design of medical devices that require small, precise, and high-accuracy components. 【Application Scenes】 - Endoscopes - Portable diagnostic devices - Biometric sensors 【Benefits of Implementation】 - Miniaturization of devices - High-density mounting - High reliability

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  • Circuit board design and manufacturing
  • Thin Film Circuit Board

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Thin Film Circuit Board for Aerospace Applications

Thin film circuit boards that achieve weight reduction and high performance.

In the aerospace industry, reducing the weight of aircraft is essential for improving fuel efficiency and performance. Particularly for electronic devices used in outer space or harsh environments, there is a demand for high reliability and durability while being compact and lightweight. Thin-film circuit boards have been developed to meet these requirements. 【Application Scenarios】 - Electronic devices for aircraft and spacecraft - Satellite-mounted equipment - Drones 【Benefits of Implementation】 - Improved fuel efficiency through weight reduction - Effective use of space through miniaturization - Increased longevity of devices due to high reliability

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  • Circuit board design and manufacturing
  • Thin Film Circuit Board

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Thin film circuit board for wearables

Thin film circuit boards that achieve high-density implementation. Contributes to miniaturization and high performance.

In the wearable device industry, there is a demand for both miniaturization and high performance. In particular, high-density implementation technology is essential to pack many functions into a limited space. Thin-film circuit boards have been developed to address this challenge. Our thin-film circuit boards achieve high-density implementation through high-precision fine circuit pattern formation technology, contributing to the miniaturization and high performance of wearable devices. [Use Cases] - Smartwatches - VR/AR devices - Healthcare devices [Benefits of Implementation] - Miniaturization of devices - Enhanced performance - Improved reliability

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  • Circuit board design and manufacturing
  • Thin Film Circuit Board

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Thin film circuit board for energy efficiency.

Contributing to energy efficiency with film formation technology and thin film processing technology!

In the energy industry, energy conservation and efficient power supply are required. In particular, high-performance electronic components are essential in fields such as solar power generation and energy storage systems. Thin-film circuit boards contribute to the miniaturization and high performance of devices in these systems, supporting improvements in energy efficiency. 【Usage Scenarios】 - Solar power generation systems - Energy storage systems - Power converters 【Benefits of Implementation】 - Enhanced device performance - Miniaturization of systems - Improved energy efficiency

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  • Circuit board design and manufacturing
  • Thin Film Circuit Board

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Thin Film Circuit Board for Measuring Instruments

Thin film circuit board contributing to the performance improvement of high-frequency measuring instruments.

In the high-frequency measurement instrument industry, accurate signal transmission and noise suppression are essential. Particularly in measurements within the high-frequency range, the dielectric properties of substrate materials and the precision of circuit patterns significantly influence the reliability of measurement results. Inadequate substrate or pattern design can lead to signal attenuation and reflection, hindering accurate measurements. Our thin-film circuit substrates contribute to the performance enhancement of high-frequency measurement instruments by using materials with high-precision fine circuit patterns and excellent thermal conductivity. 【Application Scenarios】 - High-frequency signal measurement - Testing of wireless communication devices - Development of radar systems - Evaluation of various sensors 【Benefits of Implementation】 - Improvement of high-frequency characteristics - Reduction of signal transmission loss - Enhanced noise resistance - Increased measurement accuracy

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  • Circuit board design and manufacturing
  • Thin Film Circuit Board

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Frequently Asked Questions about Thin Film Circuit Boards (Carrier and Submount)

We introduce frequently asked questions about thin film circuit substrates (carrier and submount)!

Here are some frequently asked questions about the "thin film circuit boards (carrier/submount)" that we handle. Starting with "What kind of metal is the metal thin film?" and including questions like "What is the composition of the solder? (types)" and "What kinds of films can be made with metals?" we provide answers to many inquiries. Feel free to use this information for product selection, and don't hesitate to contact us for more details. 【Excerpt of Questions】 ■ What kind of metal is the metal thin film? ■ What is the composition of the solder? (types) ■ What methods can be used for patterns? ■ What types of substrates can be prepared? ■ What kinds of equipment are available? *For more details, please refer to the related links or feel free to contact us.

  • Other metal materials
  • Thin Film Circuit Board

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Thin film circuit board for high-speed transmission

High-precision thin-film circuit boards that support high-speed data communication.

In the telecommunications industry, especially in areas where high-speed data transmission is required, it is important to minimize signal delay and noise. Thin-film circuit boards address these challenges with high-density wiring and excellent thermal conductivity. Our thin-film circuit boards are ideal for laser diode (LD) mounting substrates and optical communication applications. 【Usage Scenarios】 * Optical communication (FTTx, data centers, mobile base stations) 【Benefits of Implementation】 * Stabilization of high-speed data transmission * Improvement in signal quality * Enhanced product reliability

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  • Circuit board design and manufacturing
  • Thin Film Circuit Board

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Thin film circuit board for automobiles

Thin film circuit board achieving high reliability

In the automotive industry, the reliability of electronic components is crucial for achieving both safety and durability. Particularly for electronic components used under temperature variations, vibrations, and harsh environments, the quality of the substrate significantly affects the product's performance and lifespan. Thin-film circuit substrates address these challenges with high-precision fine circuit patterns and excellent thermal conductivity, contributing to the high performance of vehicles. 【Application Scenarios】 - In-vehicle radar - In-vehicle LED - In-vehicle sensors 【Benefits of Implementation】 - Achieving high reliability - Extending product lifespan - Contributing to high performance

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  • Circuit board design and manufacturing
  • Thin Film Circuit Board

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Thin Film Circuit Board for IoT (Submount Carrier)

Thin film circuit boards that contribute to energy saving. Free technical documentation available!

In the IoT industry, miniaturization of devices and the extension of battery life have become important challenges. To achieve energy efficiency, efficient power utilization of components is essential. Our thin-film circuit boards support the development of energy-saving devices through high-precision fine circuit pattern formation technology. 【Usage Scenarios】 - Wearable devices - Smart sensors - IoT gateways 【Benefits of Implementation】 - Miniaturization of devices - Reduction of power consumption - Extension of battery life

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  • Circuit board design and manufacturing
  • Thin Film Circuit Board

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Thin Film Circuit Board for Robotics

Thin film circuit boards supporting high-precision robot control.

In the robotics industry, advanced motion control and precise sensor information processing are required. Particularly, as robots become smaller and more high-performance, high-density mounting of circuit boards and high reliability are crucial. Thin-film circuit boards have been developed to meet these demands. 【Usage Scenarios】 - Robot arms requiring high-precision positioning control - Robots processing fine sensor information - Mobile robots that require miniaturization and lightweight design 【Benefits of Implementation】 - Miniaturization and lightweight design through high-density mounting - Performance improvement through high-precision circuit patterns - Increased longevity due to high reliability

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  • Circuit board design and manufacturing
  • Thin Film Circuit Board

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Achieving thinness with thin-film circuit boards for displays.

Thin film circuit boards contribute to the slimming down of displays!

In the display industry, there is a constant demand for thinner and more functional products. In particular, space-saving and lightweight designs are crucial factors that influence product competitiveness. To achieve thinness, it is essential to reduce the thickness of the substrate while simultaneously ensuring high reliability and performance. Our thin-film circuit substrates utilize advanced thin-film processing technology to contribute to the thinning of displays. 【Usage Scenarios】 - Thin displays - High-density mounting substrates - High heat dissipation substrates 【Benefits of Implementation】 - Increased added value of products through thinning - Realization of high-precision circuit patterns - High reliability and durability

  • 【採用】ガルバノ4.jpg
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  • Circuit board design and manufacturing
  • Thin Film Circuit Board

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